Printed Circuit Board (PCB) Failure Analysis

Understand and rectify the root causes of PCB failure with industry-leading PCB 失效分析 from the 测试 experts at im体育APP.

Most modern electronic devices – from singing birthday cards to supercomputers – rely on 印刷电路板 (PCB) technology, but electronics manufacturers continue to demand circuit boards that are both more sophisticated than ever and cheaper to produce. With the increased complexity of PCBs, the need for comprehensive 失效分析 of new PCB designs is paramount for ensuring product safety. 在im体育APP, our experts specialize in PCB 失效分析, providing invaluable insights to design engineers and helping them identify the root causes of failures.

Techniques for PCB 失效分析

Our experts employ a range of cutting-edge techniques and industry-standard tests to isolate the key factors contributing to PCB failures:

• Micro-sectioning analysis allows us to examine the internal structure of a PCB, providing crucial insights into potential defects and weaknesses.
• Solderability 测试 ensures that the solder joints are robust and reliable
• PCB contamination 测试 helps identify any contaminants that may compromise the performance of the board.
• Optical microscopy and scanning electron microscopy (SEM), helps us perform detailed examinations of PCB surfaces and components, allowing us to uncover hidden flaws.
• X-ray inspection enables us to inspect the internal features of a PCB non-destructively, facilitating accurate 失效分析

独特的挑战

Understanding the challenges faced by PCB fabricators is instrumental in conducting effective 失效分析. Some common issues we encounter include the integration of components in high-speed 印刷电路板s (HSCBs), which introduces complexities arising from the use of multiple materials and the potential for incorrect component placement. The lead-free assembly process, necessitating higher temperatures, poses risks to solder joints and electronic components. 桶疲劳, caused by differential expansion between copper plating and the board's coefficient of thermal expansion, emerges as a prevalent failure mode. Selecting the appropriate surface finish is crucial, as it directly impacts process yield, 返工, 现场故障率, 测试, 报废率, 和成本. 此外, conductive anodic filament (CAF) is a phenomenon involving electro-chemical processes leading to current leakage, intermittent electrical shorts, and dielectric breakdown between conductors in PCBs.

im体育APP优势

在im体育APP, our team of experts is well-versed in addressing the unique challenges faced by manufacturers. By working closely with clients, we provide tailored solutions that enhance product quality and reduce failures. Our in-depth understanding of 失效分析 and extensive knowledge of PCB technology allows us to deliver comprehensive reports and recommendations, empowering design engineers to revise their designs effectively and prevent future incidents.

When it comes to PCB 失效分析, trust im体育APP's expertise to deliver accurate insights and actionable solutions. With our commitment to excellence and passion for ensuring product safety, we are your trusted partner in navigating the complexities of the PCB industry. im体育APP to learn how we can support you in delivering the highest-quality products.